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Intraspec TechnologiesIntraspec Technologies
  • About us
  • Your technologies
    • Integrated circuits
    • PCB and assemblies
    • Passives and discretes
    • Optoelectronic components
  • Our techniques
    • Electrical and electro-optical characterisations
    • Focused Ion Beam
    • Light emission microscopy
    • Electron microscopy
    • Magnetic Microscopy
    • Optical Microscopy
    • Sample preparation
    • Die Thinning
    • X-Ray Imaging and Computed Tomography
    • Time Domain Reflectometry
    • SEE sensitivity
    • Laser techniques
    • Assembly test
    • Lock-in Thermography
    • Accelerated ageing
  • Our services
    • Failure analysis
    • Entry Control
    • Reliability
    • Qualification
    • Space EMC derisking
  • Tools sales
  • R&D
  • News
  • Contact us
  • Français
  • About us
  • Your technologies
    • Integrated circuits
    • PCB and assemblies
    • Passives and discretes
    • Optoelectronic components
  • Our techniques
    • Electrical and electro-optical characterisations
    • Focused Ion Beam
    • Light emission microscopy
    • Electron microscopy
    • Magnetic Microscopy
    • Optical Microscopy
    • Sample preparation
    • Die Thinning
    • X-Ray Imaging and Computed Tomography
    • Time Domain Reflectometry
    • SEE sensitivity
    • Laser techniques
    • Assembly test
    • Lock-in Thermography
    • Accelerated ageing
  • Our services
    • Failure analysis
    • Entry Control
    • Reliability
    • Qualification
    • Space EMC derisking
  • Tools sales
  • R&D
  • News
  • Contact us
  • Français

News

  • Intraspec participated in the CERBUS mission of a balloon flight over the Atlantic2024 July 11
    Open Stratospheric Balloons are popular at CNES, and for the first time, one of these ballons has crossed the Atlantic between Sweden and Canada. On
  • Toulouse is the reliability place to be this October !2023 September 19
    ESREF 2023, the essential conference on reliability and failure analysis of electronic components, opens its doors in just two weeks in Toulouse. The perfect opportunity
  • Intraspec joins the prestigious Galaxie Club2023 February 17
    Inter-company opportunities can be expected ! For more information on Galaxie Club : Club Galaxie – Les acteurs du spatial en Occitanie (club-galaxie.com)
  • Best wishes for 20232023 January 2
  • Intraspec is granted with SME LABEL by CNES2022 November 4
    For its activities in failure analysis, defect localisation, reliability,assessment of electronic, opto-electronic and optical components. It’s time to contact them !
  • Intraspec joins Cap’tronic2022 February 28
    A positive step in sharing electronic know-how and benefiting from Cap’tronic network resources !
  • Best wishes for 2022!2022 January 3
    Our Intraspec team wishes you a wonderful new year !
  • COVID19 crisis: What about lab work?2020 March 17
    For obviour sanitary reasons our laboratory is temporarily closed. Nevertheless, Intraspec’s team is fully operational and keeps offering you expertise in failure analysis, qualification and
  • Forum de l’électronique 2020 – Grenoble2020 January 9
    Intraspec will expose at the “Forum de l’électronique”, the tradeshow dedicated to French electronics industry. It will take place in Grenoble, between the 11th and

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Intraspec technologies

20, Avenue Didier Daurat 31400 Toulouse, France

 

Phone: +33 (0)9 72 42 24 74
Fax: +33 (0)5 61 27 47 32

 

contact@intraspec.com

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